No Clean Flux 1 Ltr Pack

Keeping the track of latest happening of this domain, we present the optimum quality of Low Solids No Clean Flux. The low solids no clean flux is free from halogen, non-corrosive and tack-free residue. Besides this, the rendered low solids no clean flux is very stable foaming characteristics. The quality of the low solids no clean flux is never compromised.

Features:

• Safe residue.
• High S.I.R. value
• Excellent soldering finish can be obtained with no occurrence of solder

Merits Of Using DDV-2E No Clean Flux:

• Halogen / RoHS free
• Non-corrosive and tack-free residue
• Reduced odour associated with soldering process
• Very easy to use
• Very economical
• Eliminate the need expense of cleaning
• Very stable foaming characteristics
• Safe residue
• High S.I.R. value
• Excellent soldering finish can be obtained with no occurrence of solder balling, bridge formation, icicles, etc
• Board probing after soldering can be easily done without cleaning
• No switch contact problems
• No blockage to spray nozzle

Application:

• DDV-2E no clean flux is applicable in any of the existing wave soldering machine used in the industry today. Application of the flux can be any of the three methods: Dip, Wave and Foam
• Preheat temperature of between 850 C and 1050 C on the component side of the board is recommended
• For best foaming result, the level of flux in the fluxing tank should be maintained at about 1.3 to 2.0 cm above the foaming stone
• Periodic monitoring of specific gravity with a hydrometer or automatic density censoring systems and addition of the appropriate amount of flux thinner is necessary to ascertain consistent soldering results.